NexaRAM
Access to high-speed SMT lines capable of mounting complex GPU cores and high-density GDDR6/6X VRAM with micron-level precision.
Expertise in Vapor Chambers (VC), heat pipes, and high-conductivity thermal pastes—essential for modern 300W+ TDP Graphics Cards.
Manufacturing of multi-layer PCBs (10-14 layers) with Rogers or High-TG materials to ensure signal integrity at high frequencies.
A "total cost of ownership" approach by leveraging local component sourcing and efficient logistics via Shenzhen and Hong Kong ports.
Go from design to functional prototype in as little as 10-15 days, allowing for agile responses to NVIDIA or AMD chip launches.
Adherence to CE, RoHS, and FCC standards with rigorous stress testing under extreme thermal and load conditions.
Our state-of-the-art testing facility ensuring every component meets enterprise standards.