NexaRAM NexaRAM

Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink

Product Description

Product Description
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Specification
Type CPU radiator
Texture of Material Copper base + copper fins
Heat Dissipation Method Air cooling
Power Waste 95W
Packing & Delivery
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Semi-Automatic PET Bottle Blowing Machine Bottle Making Machine Bottle Moulding Machine
PET Bottle Making Machine is suitable for producing PET plastic containers and bottles in all shapes.
FAQ
Q What is the primary material of the CPU radiator?
The CPU radiator is constructed with a high-quality copper base and copper fins, designed to ensure efficient thermal conductivity and heat transfer.
Q What type of cooling system does this radiator use?
This system utilizes a highly reliable air cooling method optimized for maintaining stable processor temperatures.
Q What is the maximum power TDP supported by this CPU radiator?
It is designed to handle a maximum power waste (TDP) of up to 95W safely and efficiently.
Q Is the packing secure enough for long-distance transport?
Yes, the products are packed using high-density protection packaging inside durable shipping cartons to prevent any damage during transit.
Q How does the copper base compare to aluminum alternatives?
The pure copper base provides significantly higher thermal conductivity compared to aluminum, allowing faster heat dissipation from the CPU chip.

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