1 / 5
NexaRAM
NexaRAM
We are a leading manufacturer specializing in high-density multilayer printed circuit boards and specialty boards. With certifications including UL, ISO9001:2015, ISO14001:2015, CQC, IATF16949:2016, and "National Military Standard," we provide top-quality products and services. Our extensive product range includes multilayer boards, impedance boards, high-frequency boards, high TG thick copper foil boards, 5G high-speed boards, buried blind via boards, aluminum-based boards, hybrid dielectric boards, HDI, rigid-flex boards, specialty boards, and customized solutions.
Driven by technological innovation, our products are widely used in industries such as communication equipment, industrial control, automotive electronics, energy and power, medical devices, IoT, research institutions, aerospace, and defense. With over 19 years of experience, we have served over 1,000 technology innovation-oriented enterprises with rapid prototyping and mass production services. We are committed to delivering cutting-edge solutions and exceeding customer expectations in the dynamic electronics industry.
Actual conditions are subject to confirmation with customer service.
As PCBs are custom products, returns are not supported. For quality issues, please contact customer service for a refund or replacement, but we do not bear any losses or costs beyond the product value. Delays in delivery due to force majeure factors such as power outages or water supply interruptions will not be compensated.
If there are any issues or special instructions, please communicate directly with customer service for confirmation. Do not leave messages, as we will not be responsible for any missed messages. Before and after payment, please confirm the process, quantity, and layers with customer service. Problems that arise after production or shipment will not be eligible for refunds. Since this product requires a high level of expertise, if the purchasing personnel are not knowledgeable, please confirm with your engineer or customer service. We will not be responsible for any issues caused by the customer's lack of understanding.
Calculation: Orders placed before 17:00 are considered as placed on the same day; orders placed after 17:00 are considered as placed the next day. "24-hour delivery" refers to one day, not 24 hours. The delivery time provided by customer service and on the page does not include Sundays or holidays.
Green solder mask, white silkscreen, 1.6mm board thickness, HASL, 1oz copper thickness, vias with solder mask, line width/spacing 0.2mm, vias above 0.3mm. The Gerber format is used according to the provided files. (The quotation is based on standard processes; please inform customer service of any special process requirements for a new quotation.)
| Rigid PCB Manufacturing Capability | Volume Production | Sample Processing | |
|---|---|---|---|
| Layer count | 1-68L | 64 Layer | |
| Max thickness | 10mm (394mil) | 14mm (551mil) | |
| Min line width/space | Inner layer | 2.2mil/2.2mil | 2.0mil/2.0mil |
| Outer layer | 2.5mil/2.5mil | 2.2mil/2.2mil | |
| Alignment capability | Alignment with core board | ±25um | ±20um |
| Inner layer alignment | ±5mil | ±4mil | |
| Max copper | 6Oz | 30 oz | |
| Holes size | Mechanical drilling | ≥0.15mm (6mil) | ≥0.1mm (4mil) |
| Laser drilling | 0.1mm (4mil) | 0.050mm (2mil) | |
| Max size | Unit size | 850mm x 570mm | 1000mm x 600mm |
| Panel size | 1250mm x 570mm | 1320mm x 600mm | |
| Aspect ratio | Unit size | 20:1 | 28:1 |
| Panel size | 25:1 | 35:1 | |
| Material | Lead-free / Halogen-free | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High-speed PCB material | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 | ||
| High-frequency PCB material | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000 | ||
| Surface finished | HAL, HAL-LF, ENIG, IMMERSION TIN, OSP, IMMERSION SILVER, GOLD FINGER, Hard Gold / Soft Gold Plating | ||
| Special technology | Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, mixed RF PCB, Busbar PCB | ||
We ship PCB orders with the following options:
| Layer | Sample Shortest Lead Time | Sample Standard Lead Time | Mass Production Lead Time |
|---|---|---|---|
| 2 layer | 24 h | 3 days | 6-7 days |
| 4 layer | 36 h | 5 days | 8-10 days |
| 6 layer | 48 h | 5 days | 8-12 days |
| 8 layer | 72 h | 5 days | 9-12 days |
| 10 layer | 4 days | 7 days | 14 days |
| 12 layer | 4 days | 7 days | 16 days |
| 14 layer | 5 days | 8 days | 16 days |
| 16 layer | 5 days | 9 days | 18 days |
| 18 layer | 7 days | 10 days | 18 days |
| 20 layer and above | To be negotiated | To be negotiated | To be negotiated |
RS-274-X, RS-274-D, CAD, DXP, Protel 99 SE, PADS, GC-CAM
