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NexaRAM
NexaRAM
We are a leading manufacturer specializing in high-density multilayer printed circuit boards and specialty boards. With certifications including UL, ISO9001:2015, ISO14001:2015, CQC, IATF16949:2016, and "National Military Standard," we provide top-quality products and services.
Our extensive product range includes multilayer boards, impedance boards, high-frequency boards, high TG thick copper foil boards, 5G high-speed boards, buried blind via boards, aluminum-based boards, hybrid dielectric boards, HDI, rigid-flex boards, specialty boards, and customized solutions.
Driven by technological innovation, our products are widely used in industries such as communication equipment, industrial control, automotive electronics, energy and power, medical devices, IoT, research institutions, aerospace, and defense. With over 19 years of experience, we have served over 1,000 technology innovation-oriented enterprises with rapid prototyping and mass production services. We are committed to delivering cutting-edge solutions and exceeding customer expectations in the dynamic electronics industry.
| Rigid PCB Manufacturing Capability | ||
|---|---|---|
| Category | Volume Production | Sample Processing |
| Layer Count | 1-68L | 64 Layer |
| Max Thickness | 10mm (394mil) | 14mm (551mil) |
| Min Line Width/Space (Inner Layer) | 2.2mil / 2.2mil | 2.0mil / 2.0mil |
| Min Line Width/Space (Outer Layer) | 2.5mil / 2.5mil | 2.2mil / 2.2mil |
| Alignment (Core Board) | ±25um | ±20um |
| Alignment (Inner Layer) | ±5mil | ±4mil |
| Max Copper | 6Oz | 30 oz |
| Holes Size (Mechanical Drilling) | ≥0.15mm (6mil) | ≥0.1mm (4mil) |
| Holes Size (Laser Drilling) | 0.1mm (4mil) | 0.050mm (2mil) |
| Max Size (Unit Size) | 850mm x 570mm | 1000mm x 600mm |
| Max Size (Panel Size) | 1250mm x 570mm | 1320mm x 600mm |
| Aspect Ratio (Unit Size) | 20:1 | 28:1 |
| Aspect Ratio (Panel Size) | 25:1 | 35:1 |
| Lead-Free/Halogen-Free Materials | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High-Speed PCB Material | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 | |
| High-Frequency PCB Material | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | |
| Others Materials | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000 | |
| Surface Finished | HAL, HAL-LF, ENIG, IMMERSION TIN, OSP, IMMERSION SILVER, GOLD FINGER, Hard Gold/Soft Gold Plating | |
| Special Technology | Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, mixed RF PCB, Busbar PCB | |
We ship PCB orders with the following options:
| Layer | Sample Shortest Lead Time | Sample Standard Lead Time | Mass Production Lead Time |
|---|---|---|---|
| 2 layer | 24 h | 3 days | 6-7 days |
| 4 layer | 36 h | 5 days | 8-10 days |
| 6 layer | 48 h | 5 days | 8-12 days |
| 8 layer | 72 h | 5 days | 9-12 days |
| 10 layer | 4 days | 7 days | 14 days |
| 12 layer | 4 days | 7 days | 16 days |
| 14 layer | 5 days | 8 days | 16 days |
| 16 layer | 5 days | 9 days | 18 days |
| 18 layer | 7 days | 10 days | 18 days |
| 20 layer and above | To be negotiated | To be negotiated | To be negotiated |
We specialize in high-density multilayer printed circuit boards and specialty boards. Our product range includes multilayer boards, impedance boards, high-frequency boards, high TG thick copper foil boards, 5G high-speed boards, buried blind via boards, aluminum-based boards, hybrid dielectric boards, HDI, rigid-flex boards, and customized solutions.
Our manufacturing processes are certified under UL, ISO9001:2015, ISO14001:2015, CQC, IATF16949:2016, and "National Military Standard." We operate strictly according to these quality management systems to guarantee 100% quality.
For standard 2-layer PCBs, the shortest sample lead time is 24 hours, and standard lead time is 3 days, with mass production taking 6-7 days. For multi-layer boards up to 18 layers, sample lead times range from 36 hours to 7 days, and mass production ranges from 8 to 18 days. Lead times for 20 layers and above can be negotiated.
We accept various design file formats including RS-274-X, RS-274-D, CAD, DXP, Protel 99 SE, PADS, and GC-CAM.
We provide several shipping options: Air shipping (via UPS, DHL, TNT, CTS, and FEDEX), Railway shipping, Seaborne shipping, and customer-designated shipping methods.
We support a wide array of specialized materials including Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, and TU933 for high-speed applications; and Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, and FastRise27 for high-frequency applications.
