NexaRAM
Manufacturer supplies AMD SP3 1U server with high-power CPU heat sink, copper bottom cooling chip, and uniform heating version
| Model | TC009 |
| Type | AMD heat sink |
| Texture of material | Copper aluminum bonding |
| Bearing type | Double ball bearings |
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Q1: Which CPU sockets is this 1U heatsink compatible with?
A1: This server CPU heatsink is designed specifically for the AMD SP3 socket platform, making it fully compatible with high-performance AMD server processors.
Q2: How does the copper bottom design benefit heat dissipation?
A2: The copper bottom cooling chip features a uniform heating plate version that rapidly absorbs heat directly from the CPU core and spreads it efficiently to the aluminum fins, preventing local overheating.
Q3: What are the main benefits of double ball bearings in the cooling system?
A3: Double ball bearings offer superior durability, heat resistance, and a longer operational lifespan compared to sleeve bearings. They are ideal for 24/7 continuous server runtimes.
Q4: Can this heatsink fit in a standard 1U height server chassis?
A4: Yes, the TC009 heatsink is explicitly engineered with a low-profile design to meet the strict height and space limitations of standard 1U rackmount server enclosures.
Q5: What materials are used in the construction of the TC009?
A5: It utilizes a hybrid copper-aluminum bonding construction to provide the ideal balance between rapid thermal conduction (copper base) and light weight, cost-effective heat dissipation (aluminum fins).
Q6: How are the products packaged for transit safety?
A6: Each unit is securely packaged using professional shockproof and environmentally friendly materials to prevent physical damage and ensure the hardware arrives in perfect working condition.