NexaRAM
NexaRAM
Industrial Thermal Management & High-TG PCBs for San José Tech Hubs and Latin American Hyperscale Infrastructure.
Send Inquiry NowHigh-reliability compute boards and memory modules engineered for stable thermal execution in Central American enterprise hubs.
Costa Rica has emerged as one of the preeminent tech corridors in Central America, driven by massive investments in Free Trade Zones (Zonas Francas) like Coyol and Ultrapark. This shift from agricultural focus to high-technology manufacturing and advanced engineering services has created a critical demand for sophisticated hardware. In particular, the deployment of cloud infrastructure, local data centers, and advanced manufacturing instrumentation requires components capable of surviving demanding operations.
In this tropical maritime climate, thermal management is not a secondary consideration—it is the direct differentiator between system longevity and catastrophic downtime. Computing centers located in San José, Heredia, and Alajuela face unique combinations of high ambient humidity and variable cooling parameters. Standard electronics fail prematurely due to thermal stress. As a result, the integration of High-TG (Glass Transition Temperature) PCBs has become an industry standard for hardware deployed in the region.
At NexaRAM, we synthesize our experience in memory manufacturing with advanced thermal engineering. We understand that server components and memory modules require radiators and PCBs that exceed general specifications. By manufacturing server radiators that are optimized for high-power thermal loops and implementing multi-layer High-TG board structures, we ensure that enterprises operating within Costa Rica experience maximum uptime and operational efficiency.
Modern microprocessors, including the latest Intel LGA4189 sockets and AMD AM5 platforms, push thermal design limits to their boundaries. Under sustained workloads like AI training, containerized virtualization, and financial transaction processing, heat generation increases non-linearly. To address this, our factory constructs heavy-duty server radiators utilizing two core engineering technologies: copper skived-fin structures and heat-pipe integration.
Copper is chosen for its superior thermal conductivity (approx. 401 W/m·K) compared to aluminum. By matching a pure copper base plate with high-density fin patterns, we increase the overall heat transfer surface area without expanding the physical footprint of the 1U or 2U server chassis. For environments in Costa Rica where rack density is optimized for cost savings, these low-profile, high-capacity server radiators are critical for maintaining safe operational junctions.
Through advanced thermal modeling and real-world testing, our radiator layouts minimize air-flow resistance. This decreases the power required by server chassis fans, lowering the overall Power Usage Effectiveness (PUE) of data centers. Lower PUE directly translates to cost reduction and aligns with the green data center mandates popular across Costa Rica's technological sectors.
A global leader in high-performance memory modules and customized hardware cooling solutions.
NexaRAM Storage Technology Co., Ltd. is a professional DDR5 memory manufacturer specializing in high-performance RAM solutions for global OEMs, data centers, and enterprise computing applications. Established in 2016, the company has rapidly developed into a reliable supplier in the advanced DRAM industry.
The company operates a modern production facility with a total building area of approximately 320㎡, equipped with advanced manufacturing and testing equipment to ensure stable and efficient production capacity. NexaRAM has an annual export revenue of approximately USD 12 million, with 6 years of export experience and 12 years of industry experience in memory and semiconductor-related fields.
Quality is strictly controlled through a combination of automated optical inspection (AOI) and burn-in reliability testing, supported by a professional QC team of 35 inspectors. The company follows international trade compliance standards and operates under a strong global trading background, serving markets across North America, Europe, Southeast Asia, and the Middle East, and expanding actively with customized service support for the Costa Rica tech hubs.
NexaRAM maintains a highly developed supply chain ecosystem with over 850 strategic supply chain partners, enabling stable sourcing of high-grade semiconductor materials and components. Its primary customer base includes OEM manufacturers, system integrators, server solution providers, and gaming PC brands.
The company demonstrates strong R&D capabilities, offering custom DDR5 module design, PCB layout optimization, frequency tuning, and thermal solution development. Flexible customization options include frequency, latency, capacity, heat spreader design, and branding services.
In the past year, NexaRAM launched 120 new product variants, supported by a dedicated R&D team of 180 engineers, continuously driving innovation in high-speed memory solutions for next-generation computing systems.
Every memory module and radiator undergoes strict validation protocols, ensuring enterprise-grade performance under rigorous industrial loads.
Global enterprise technology organizations require procurement chains that demonstrate risk resilience, consistent product yield, and strict adherence to technical standards. For purchasing managers supplying equipment to operations within Costa Rican Free Trade Zones, component traceability is a primary requirement. Our operations utilize manufacturing processes that track component paths from raw silicon wafer slicing to final memory packaging and radiator assembly.
Our strategic partnership network of over 850 supply chain entities allows us to maintain stock of premium Grade-A DRAM dies and high-purity copper, avoiding the logistics blockages common in contemporary hardware ecosystems. Combined with custom layout design options and variable thermal dissipation modules, we provide customized integration support for projects of varying configurations.
Whether your enterprise utilizes specialized rack profiles in San José or runs dedicated industrial controllers, we provide tailored design configurations:
As system architectures transition from DDR4 to DDR5 platforms, memory module designs face higher complexity. DDR5 transfers power management from the motherboard to the module via an onboard Power Management IC (PMIC). While this design increases efficiency, it relocates thermal generation sources directly onto the memory PCB, necessitating optimized dissipation solutions.
Furthermore, CPU architectures continue to scale core counts, elevating thermal outputs to over 400 watts per socket. Liquid cooling blocks and vapor chamber assemblies represent the main evolutionary path for modern server rooms. Our research and development team is designing hybrid systems that integrate direct-die liquid loops with micro-groove copper radiators, maximizing heat extraction while maintaining compatibility with legacy rack formats.
Partner with an established industrial memory and cooling manufacturer to optimize your local data installations in Costa Rica. Reach out to our design department for engineering evaluation files.
Send Inquiry NowTechnical insights regarding radiators, high-TG boards, and memory deployment in Central America.
The tropical climate has high relative humidity, which can accelerate delamination and Conductive Anodic Filament (CAF) degradation in standard FR4 boards under load. High-TG (Glass Transition Temperature) boards (above 170°C) prevent structural shifts and maintain dimensional stability, ensuring continuous operation under hot, humid server room environments.
Our cooling solutions are precision-engineered to match the exact retention mechanisms, contact profiles, and mounting hole alignments of modern Intel (LGA4189, LGA1700) and AMD (AM5) platforms. Every radiator batch is checked via Coordinate Measuring Machines (CMM) to guarantee fitment accuracy.
We employ a multi-layered quality control workflow including Automated Optical Inspection (AOI) for structural integrity, in-system validation for clock cycles, and thermal burn-in chambers to filter out infant mortality failures before shipment. Our 35 QC inspectors verify all parameters against JEDEC guidelines.
We ship via major international freight handlers directly into Juan Santamaría Airport (SJO) or via maritime terminals at Puerto Limón and Caldera. Typically, standard custom order batches are dispatched within 3-4 weeks from design sign-off, with direct logistics clearing support available for Free Zone operations.
Yes. We supply both passive skived-fin radiators designed for high-static-pressure fan modules and high-performance copper water-cooling blocks suited for direct-to-chip liquid cooling loops, engineered for high-density architectures.
Moving power management directly onto the DDR5 PCB yields cleaner power signals but creates localized hotspots. Our modules can be configured with specialized heat spreaders containing high-thermal-conductivity gap pads that contact the PMIC and DRAM packages, distributing heat efficiently.
Absolutely. All materials, including high-TG boards, solder alloys, and plating finishes (HASL lead-free or ENIG), comply with RoHS and REACH standards, ensuring smooth customs entry into Costa Rica and other international markets.
Yes. We offer pre-applied phase-change thermal interface materials (TIMs) or high-grade thermal pads on radiator bases. This decreases assembly complexity during system integration, reducing assembly times for local technicians.
Explore our extensive range of memory configurations, server thermal assemblies, and custom PCB prototypes.
