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NexaRAM
NexaRAM
We are a leading manufacturer specializing in high-density multilayer printed circuit boards and specialty boards. With certifications including UL, ISO9001:2015, ISO14001:2015, CQC, IATF16949:2016, and "National Military Standard," we provide top-quality products and services.
Our extensive product range includes multilayer boards, impedance boards, high-frequency boards, high TG thick copper foil boards, 5G high-speed boards, buried blind via boards, aluminum-based boards, hybrid dielectric boards, HDI, rigid-flex boards, specialty boards, and customized solutions.
Driven by technological innovation, our products are widely used in industries such as communication equipment, industrial control, automotive electronics, energy and power, medical devices, IoT, research institutions, aerospace, and defense. With over 19 years of experience, we have served over 1,000 technology innovation-oriented enterprises with rapid prototyping and mass production services. We are committed to delivering cutting-edge solutions and exceeding customer expectations in the dynamic electronics industry.
| Rigid PCB Manufacturing Capability | ||
|---|---|---|
| Category | Volume Production | Sample Processing |
| Layer Count | 64 Layer | 1-68L |
| Max Thickness | 14mm (551mil) | 10mm (394mil) |
| Min Line Width / Space | ||
| - Inner Layer | 2.0mil / 2.0mil | 2.2mil / 2.2mil |
| - Outer Layer | 2.2mil / 2.2mil | 2.5mil / 2.5mil |
| Alignment Capability | ||
| - Alignment with Core Board | ±20μm | ±25μm |
| - Inner Layer Alignment | ±4mil | ±5mil |
| Max Copper | 30 oz | 6 oz |
| Holes Size | ||
| - Mechanical Drilling | ≥0.1mm (4mil) | ≥0.15mm (6mil) |
| - Laser Drilling | 0.050mm (2mil) | 0.1mm (4mil) |
| Max Size | ||
| - Unit Size | 1000mm X 600mm | 850mm X 570mm |
| - Panel Size | 1320mm X 600mm | 1250mm X 570mm |
| Aspect Ratio | ||
| - Unit Size | 28:1 | 20:1 |
| - Panel Size | 35:1 | 25:1 |
| Material Processing Capability | ||
| Lead-Free / Halogen-Free | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High-Speed PCB Material | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 | |
| High-Frequency PCB Material | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | |
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000 | |
| Surface Finished | HAL, HAL-LF, ENIG, IMMERSION TIN, OSP, IMMERSION SILIVER, GOLD FINGER, Hard Gold/Soft Gold Plating | |
| Special Technology | Blind & buried holes, Via in pad, Semi-plating holes, Counterbore, Step mounting holes, drill Mixed RF PCB, Busbar PCB | |
We offer flexible and reliable shipping options for all PCB orders:
| Layer Count | Sample Shortest Lead Time | Sample Standard Lead Time | Mass Production Lead Time |
|---|---|---|---|
| 2 Layer | 24 h | 3 days | 6-7 days |
| 4 Layer | 36 h | 5 days | 8-10 days |
| 6 Layer | 48 h | 5 days | 8-12 days |
| 8 Layer | 72 h | 5 days | 9-12 days |
| 10 Layer | 4 days | 7 days | 14 days |
| 12 Layer | 4 days | 7 days | 16 days |
| 14 Layer | 5 days | 8 days | 16 days |
| 16 Layer | 5 days | 9 days | 18 days |
| 18 Layer | 7 days | 10 days | 18 days |
| 20 Layer & Above | To be negotiated | To be negotiated | To be negotiated |
