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NexaRAM
NexaRAM
| Items | Capacity |
|---|---|
| 1. Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. |
| 2. Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
| 3. Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| 4. PCB Max panel size | 1150mm × 560mm |
| 5. Layer | Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers |
| 6. Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| 7. PCBA QC | X-ray, AOI Test, Functional Test |
A: Gerber or Eagle, BOM listing, PNP and Components Position.
A: Yes, we can custom samples for your testing before mass production.
A: Within 6 hours for PCB quotation and around 24 hours for PCBA quotation.
A: 7-10 days for PCB production and components purchasing, and 10 days for PCB assembly and Testing.
A: Your files are held in complete safety and security while we are in possession of them. Your files are never shared with any third parties, only our colleagues have access to your design files. Since they are your property, we respect the copyright of your files. The customer controls the disposition of these files per your requirements and written approval.
A: Yes, we can, we have no MOQ. We have the capability to produce circuit boards in any amount.
